3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdPbc-0920 and Flatness of Bonded Wafer

and Flatness of Bonded Wafer Stacks

1  The control of parameters

mass flow controllers (MFCs)

SEMI C2 — Specifications for Etchants (Withdrawn 0308)

0% min and Ethyl benzene 1% max

3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdPbc-0920 and Flatness of Bonded Wafer1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe individual wafers in a 3DS IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking