E19400 - SEMI E194 - Guide to Using a Liquid Particle Counter to Assess Particulate Surface Contamination on Critical Chamber Components and Coupons StdTpc-Equipment Communications 6-0698 (first published)

6-0698 (first published)

7 mm (1/2 in

The potential and actual effects of bond voids on the performance and reliability of fabricated devices are beyond the scope of this Guide

The specification recognizes only two discrete material forms monocrystalline and multicrystalline

The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process

E19400 - SEMI E194 - Guide to Using a Liquid Particle Counter to Assess Particulate Surface Contamination on Critical Chamber Components and Coupons StdTpc-Equipment Communications 6-0698 (first published)1 Purpose 1. 1 This Guide describes analytical methods for determining the extractable surface particles from a critical chamber component (CCC) or a coupon by using ultrasonic aided, deionized water (DIW) extraction followed by using a liquid particle counter (LPC). 1. 2 This Guide is intended to promote communication among the relevant parties (e. g., processing equipment users, processing equipment manufacturers, CCC manufacturers, cleaning service