M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical 3D angular luminance uniformity

3D angular luminance uniformity

This Test Method is suitable for acceptance testing when used with referenced standards

process differences

SEMI E62-1106 (technical revision)

クロミウムをドープすると高抵抗の材料が得られる。しかし，プロセス中にクロムが素早く拡散することや表面に蓄積する傾向があるため，グレード3

M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical 3D angular luminance uniformityThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published November 2001. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of this document is to provide a guide for evaluation of chemical mechanical polishing (CMP)