C06300 - SEMI C63 - Specification for Organosilicate Precursors Used in Low K CVD Processes Revision:SEMI C63-1108 - Superseded This Guide will assist the

This Guide will assist the user in selection and use of tools for performing measurements of geometrical parameters of an individual through-silicon via (TSV)

SEMI C69-1224 (technical revision)

SEMI 3D8-0514 (first published)

when deviation from expected performance is likely or suspected

The wafer bonding technique used was oxide bonding

C06300 - SEMI C63 - Specification for Organosilicate Precursors Used in Low K CVD Processes Revision:SEMI C63-1108 - Superseded This Guide will assist theThis Standard was technically approved by the Liquid Chemicals Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 13, 2017. Available at www. semiviews. org and www. semi. org in June 2018; originally published November 2007; previously published November 2008. The purpose of this Document is to provide guidelines for organosilicate precursors used in Low K CVD processes and