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The metrics calculated by this Test Method are based on a thickness data array (see also SEMI MF1530)
This Standard covers PCL specifications for both Fixed Buffer Equipment and Internal Buffer Equipment
This Standard only applies to components for systems which control flow of ≤50 slm nitrogen equivalent at 308 kPa (44
SEMI MF43-0316 (Reapproved 0921)
SEMI E40-0301 (technical revision)
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Revision:SEMI G13-1122 - Current The metrics calculated by thisThe thermal expansion ratio and glass transition temperature of molding compounds are the key characteristics which effects the productivity and reliability of the plastic packages. The purpose of this Test Method is to determine procedures for thermal expansions characteristics of molding compound. This Test Method describes the procedure for measuring the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of thermosetting
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