SEMI E113-0306 (technical revision)
— XMLメッセージ通信に関する仕様は下記を対象範囲に含む。 W3C のSimple Object Access Protocol（SOAP）の使用 — SEMIのメッセージ通信アプリケーションに使う基本メッセージ通信の根拠としてSOAPを使用する。
SEMI E111-0303 (technical revision)
The scope of this Document covers MIBC which is used in the semiconductor industry
and repair this equipment
3D00400 - SEMI 3D4 - Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks StdDcs-Superseded SEMI E113-0306 (technical revision)1 Purpose 1. 1 This Guide provides a description of tools that can be used to determine these key parameters before, during, and after the process steps involved in wafer bonding. Control of parameters such as bonded wafer stack (BWS) thickness, total thickness variation (TTV), bow, warp sori, and flatness, is essential to successful implementation of a wafer bonding process. These parameters provide meaningful information about the quality of the
