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SEMI G87 — Specification for Plastic Tape Frame for 300 mm Wafer
This Document is intended for TSVs in silicon
This edition was approved for publication by the global Audits and Reviews Subcommittee on March 16
NOTICE: This translation is a REFERENCE COPY ONLY
Rough surfaces have been known to contribute to the shedding of particles
C02300 - SEMI C23 - Specification for Buffered Oxide Etchants SEMIViews SEMI G87 — Specification forThe purpose of this Specification is to standardize requirements for buffered oxide etchants used in the semiconductor industry and testing procedures to support those standards. Test methods have been shown to give statistically valid results. Alternative methods may be used as long as they comply with SEMI C1 requirements for method validation. The scope of this Specification is grades of buffered oxide etchants used in the semiconductor industry.