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The Test Method is applicable to wafers 50 mm or larger in diameter
SEMI PV83-0318 (first published)
SEMI E123-0217 (Reapproved 0623)
This Guide should be used in conjunction with SEMI F61 and SEMI F63
The document provides a framework for carrying out risk assessments on equipment in the semiconductor and similar industries and is intended for use by supplier and purchaser as a reference for EHS considerations
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly StdPbc-0212 The Test Method is applicableThis specification defines the standard requirements for co fired ceramic brazed lead flatpack package constructions intended for automated assembly to printed wiring boards. Acceptance criteria for package constructions, including leadframes, are included. Referenced SEMI Standards None.
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