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For a knowledge of the strength determining factors (such as fatigue and stress corrosion) of wafer bonding
This Specification applies to high-purity gas piping systems and components used in semiconductor manufacturing facilities and comparable research and development areas
The purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT)
This Standard describes procedures for the measurement of flexible thin film PV module and severity of test requirements
orgで入手可能となる。初版は2000年2月発行，前版は2004年11月発行。
MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets StdPbc-0316 For a knowledge of the1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide
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