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G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0817 The third parameter type

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Description

The third parameter type

This Guide references SEMI E78

12-0698 (Reapproved 0706)

NOTICE: This translation is a REFERENCE COPY ONLY

This creates an ambiguity in measuring the edge lengths and other geometrical dimensions of wafers

G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0817 The third parameter typeReferenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G10 Standard Method of Mechanical Measurement SEMI G21 Specification for Plating Integrated Circuit Leadframes

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